Bi-directional lamination head and method

ABSTRACT

A lamination head having bi-directional layup capability has a material supply drum configured to support a material roll of backed material which is comprised of layup material backed by a backing layer. A backing layer separation assembly receives the backed material from the material supply drum and has a backing layer directional control device and first and second backing layer separation mechanisms. The backing layer directional control device in the first mode separation position is aligned with the first backing layer separation mechanism for separating the backing layer from the layup material as the lamination head moves along a first direction of travel. The backing layer directional control device in the second mode separation position is aligned with the second backing layer separation mechanism for separating the backing layer from the layup material as the lamination head moves along a second direction of travel.

FIELD

The present disclosure relates generally to manufacturing systems and,more particularly, to a lamination head for laying up compositelaminates and having bi-directional layup capability.

BACKGROUND

Composite materials are used in a wide variety of applications due totheir favorable properties such as high specific strength, high specificstiffness, and high corrosion resistance. The manufacturing of acomposite structure typically involves the laying up of multiple pliesof layup material in a stacked formation on a layup surface to form acomposite laminate. The layup material is typically a fibrous materialthat is pre-impregnated with uncured resin (e.g., prepreg). For example,the layup material may be epoxy-impregnated carbon fiber prepreg.

Automated layup machines enable the layup of composite laminates atrelatively high production rates due to the relatively high depositionrates of automated layup machines. A tape lamination head is one type ofautomated layup machine in which a continuous strip of layup materialsuch as prepreg tape is dispensed from the lamination head onto a layupsurface as the lamination head is moved over the layup surface. Alamination head may form each composite ply by successively laying uprows or courses of tape in side-by-side parallel relation to each other.

A conventional lamination head may lay up each new course of tape whilemoving in a first direction of travel. At the end of a course, thelamination head lifts off of the layup surface and moves back over thelayup surface in a second direction of travel opposite the firstdirection of travel and starts applying another course of tape along thefirst direction. The off-part movement of the lamination head each timeit moves along the second direction undesirably adds to production flowtime.

Certain types of lamination heads may be configured to rotate 180degrees at the end of a first course, and then reverse direction to layup a second course of layup material alongside or over the first course.The capability for rotating the lamination head adds complexity to thelamination system due to the need to rotate the entire weight of thelamination head, the material supply, support cabling, and otherassociated components. Further adding to the complexity is the need totemporarily lift the lamination head off of the layup surface prior torotation, and then lower the lamination head back down onto the layupsurface once rotation is complete.

A further drawback associated with conventional lamination heads isregarding the initial threading of the tape that must performed prior tolaying up tape. Prepreg tape is typically provided in roll form on amaterial supply drum which is then mounted on the lamination head. Toprevent adhesion between the adjacent windings of prepreg tape on thematerial roll, the prepreg tape is backed by a backing layer. As thetape is dispensed from the material roll and applied to the layupsurface, the backing layer is removed and is wound onto a backing layercollection drum mounted on the lamination head. When the material rollis depleted of tape, it is necessary to changeout the depleted materialroll and install a new material roll on the lamination head. After eachmaterial roll changeout, the tape from the new material roll must bethreaded through the lamination head components and onto the backinglayer collection drum.

In conventional lamination heads, the process of threading the tape is atime-consuming operation that can result in significant lamination headdowntime. During the course of laying up a single composite laminate, itmay be necessary to perform numerous material roll changeouts, each ofwhich requires manual threading of the tape which adds to the laminationhead downtime and increases production flow time.

As can be seen, there exists a need in the art for a lamination headthat reduces off-part movement of the lamination head. In addition,there exists a need in the art for a lamination head that allows forrapid threading of tape through the lamination head.

SUMMARY

The above-noted needs associated with manufacturing composite laminatesare specifically addressed and alleviated by the present disclosurewhich provides a lamination head having self-threading capability and/orbi-directional layup capability. In an embodiment, the lamination headhas self-threading capability and includes a material supply drum, abacking layer collection drum, and a backing layer separation assembly.The material supply drum is configured to support a material roll ofbacked material. The backed material comprises layup material backed bya backing layer. The backing layer collection drum is configured to movefrom a collection drum home position to a collection drum engagementposition proximate the material supply drum, engage a backing layerleading edge of the backing layer on the material roll, and move back tothe collection drum home position while dispensing a threadable portionof at least the backing layer between the material supply drum and thebacking layer collection drum. The backing layer separation assembly hasa backing layer separation device and at least one backing layerseparation mechanism. The backing layer separation device is configuredto translate from a separation device home position to a separationdevice engagement position and engage the threadable portion for movingthe threadable portion into proximity to the backing layer separationmechanism for separating the backing layer from the layup material priorto application of the layup material onto a substrate.

In a further example, a lamination head having self-threading capabilityincludes a material supply drum configured to support a material roll ofbacked material. As mentioned above, the backed material comprises layupmaterial backed by a backing layer. In addition, the lamination headincludes a backing layer collection drum configured to move from acollection drum home position to a collection drum engagement positionproximate the material supply drum, engage a backing layer leading edgeof the backing layer on the material roll, and move back to thecollection drum home position while dispensing a threadable portion ofat least the backing layer between the material supply drum and thebacking layer collection drum. The lamination head also includes abacking layer separation assembly having a backing layer separationdevice and at least one backing layer separation mechanism. The backinglayer separation device is configured to translate from a separationdevice home position to a separation device engagement position andengage the threadable portion for moving the threadable portion intoproximity to the backing layer separation mechanism for separating thebacking layer from the layup material prior to application of the layupmaterial onto a substrate. The backing layer separation mechanism has abacking layer separator configured to separate the backing layer fromthe layup material and direct the layup material toward the substrate.

Also disclosed is a method of threading layup material through alamination head. The method includes supporting, on a material supplydrum, a material roll of backed material. The backed material compriseslayup material backed by a backing layer. The method further includestranslating a backing layer collection drum from a collection drum homeposition to a collection drum engagement position proximate the materialsupply drum, engaging the backing layer collection drum to a backinglayer leading edge of the backing layer on the material roll, andtranslating the backing layer collection drum back to the collectiondrum home position while dispensing a threadable portion of at least thebacking layer between the material supply drum and the backing layercollection drum. The method additionally includes translating a backinglayer directional control device from a separation device home positionto a separation device engagement position. The method also includesmoving, in response to translation of the backing layer directionalcontrol device, the threadable portion into proximity to at least onebacking layer separation mechanism configured to separate the backinglayer from the layup material prior to application of the layup materialonto a substrate.

In addition, disclosed is a lamination head having bi-directional layupcapability. The lamination head includes a material supply drumconfigured to support a material roll of backed material. The backedmaterial comprises layup material backed by a backing layer. Thelamination head includes a backing layer separation assembly configuredto receive the backed material from the material supply drum. Thelamination head as a backing layer directional control device, a firstbacking layer separation mechanism, and a second backing layerseparation mechanism. The backing layer directional control device ismovable at least between a first mode separation position and a secondmode separation position. The backing layer directional control devicein the first mode separation position is aligned with the first backinglayer separation mechanism for separating the backing layer from thelayup material while the layup material is applied to a substrate as thelamination head moves along a first direction of travel. The backinglayer directional control device in the second mode separation positionis aligned with the second backing layer separation mechanism forseparating the backing layer from the layup material while the layupmaterial is applied to the substrate as the lamination head moves alonga second direction of travel opposite the first direction of travel.

In a further example, a lamination head having self-threading capabilityincludes a material supply drum configured to support a material roll ofbacked material. The backed material comprises layup material backed bya backing layer. The lamination head includes a backing layer separationassembly configured to receive the backed material from the materialsupply drum and having a backing layer directional control device, afirst backing layer separation mechanism, and a second backing layerseparation mechanism. The backing layer directional control device ismovable at least between a first mode separation position and a secondmode separation position. The backing layer directional control devicein the first mode separation position is aligned with the first backinglayer separation mechanism. The first backing layer separation mechanismhas a first backing layer separator configured to separate the backinglayer from the layup material and direct the layup material toward thesubstrate as the lamination head moves along a first direction oftravel. The backing layer directional control device in the second modeseparation position is aligned with the second backing layer separationmechanism. The first backing layer separation mechanism as a secondbacking layer separator configured to separate the backing layer fromthe layup material and direct the layup material toward the substrate asthe lamination head moves along a second direction of travel.

Also disclosed is a method of bi-directionally applying layup materialonto a substrate. The method includes feeding a backed material from amaterial roll to a backing layer separation assembly of a laminationhead. The material roll is supported on a material supply drum. Thebacked material comprises layup material backed by a backing layer. Thebacking layer separation assembly has a backing layer directionalcontrol device movable between a first mode separation position and asecond mode separation position. The method additionally includesseparating, with the backing layer directional control device in thefirst mode separation position, the layup material from the backinglayer using a first backing layer separation mechanism while applyinglayup material to the substrate when moving the lamination head along afirst direction of travel. The method also includes moving the backinglayer directional control device from the first mode separation positionto the second mode separation position and separating, with the backinglayer directional control device in the second mode separation position,the layup material from the backing layer using a second backing layerseparation mechanism while applying layup material to the substrate whenmoving the lamination head along a second direction of travel oppositethe first direction of travel.

The features, functions and advantages that have been discussed can beachieved independently in various embodiments of the present disclosureor may be combined in yet other embodiments, further details of whichcan be seen with reference to the following description and drawingsbelow.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features of the present disclosure will become moreapparent upon reference to the drawings wherein like numbers refer tolike parts throughout and wherein:

FIG. 1 is perspective view of a manufacturing system showing an exampleof a lamination head applying layup material to a substrate;

FIG. 2 is a top view of an example of the manufacturing system showing agantry supporting the lamination head;

FIG. 3 is a side view of the manufacturing system of FIG. 2;

FIG. 4 is an end view of the manufacturing system of FIG. 2;

FIG. 5 is a front view of the lamination head supported by the gantry;

FIG. 6 is a front view of the lamination head having a material supplydrum supporting a material roll of backed material comprising a layupmaterial backed by a backing layer, and further illustrating a backinglayer collection drum shown located in a collection drum home position,a cutter platen shown in a platen home position, a backing layerseparation device shown in a separation device home position, a firstbacking layer separation assembly, and a second backing layer separationassembly;

FIG. 7 is a view of the lamination head showing the backing layercollection drum after movement from the collection drum home position toa collection drum engagement positioned adjacent to the material supplydrum;

FIG. 8 is a magnified view of the encircled region identified byreference numeral 8 of FIG. 7 and illustrating the backing layercollection drum having a backing layer pick element configured as amagnet for magnetic attachment to a magnetic element mounted to abacking layer leading edge of the backing layer on the material roll;

FIG. 9 is a magnified view of the encircled region identified byreference numeral 9 of FIG. 8 and illustrating the layup material andbacking layer that make up the backed material wound on the materialroll;

FIG. 10 is an example of the backing layer pick element configured as avacuum nozzle fluidly coupled to a vacuum source for vacuum engagementto an outer surface of the backing layer leading edge;

FIG. 11 is an example of the backing layer pick element configured as ahook element configured to engage a corresponding loop element mountedon the backing layer leading edge;

FIG. 12 is a view of the lamination head showing the backing layercollection drum moved to the collection drum home position whiledispensing a threadable portion of the backing layer between thematerial supply drum and the backing layer collection drum;

FIG. 13 is a view of the lamination head showing the backing layerseparation device configured as a backing layer directional controldevice which is configured as a pivoting device shown moved from theseparation device home position to a separation device engagementposition, and further illustrating the cutter platen moved from theplaten home position to a platen engagement position;

FIG. 14 is a sectional view of the lamination head taken along line14-14 of FIG. 13 and illustrating the backing layer directional controldevice moved into a retracted position inside the lamination head;

FIG. 15 is a view of the lamination head showing the backing layerdirectional control device moved from a neutral position to a first modeseparation position;

FIG. 16 is a magnified view of the encircled region identified byreference numeral 16 of FIG. 15 and illustrating the backing layerdirectional control device pivoted into the first mode separationposition and aligned with a first backing layer separation mechanism forseparating the backing layer from the layup material while the layupmaterial is applied to a substrate as the lamination head moves along afirst direction of travel;

FIG. 17 is a view of the lamination head showing the backing layerdirectional control device moved to a second mode separation position;

FIG. 18 is a magnified view of the encircled region identified byreference numeral 18 of FIG. 17 and illustrating the backing layerdirectional control device in the second mode position and aligned witha second backing layer separation mechanism for separating the backinglayer from the layup material while the layup material is applied to thesubstrate as the lamination head moves along a second direction oftravel opposite the first direction of travel;

FIG. 19 is a view of the lamination head showing the backing layerdirectional control device moved back to the separation device homeposition and illustrating the cutter platen moved from back to theplaten home position and further illustrating the backing materialextending between a depleted material roll and the backing layercollection drum;

FIG. 20 is a view of the lamination head showing the backing layercollection drum moved from the collection drum home position to thecollection drum engagement position for winding the backing layer ontothe depleted material roll mounted on the material supply drum;

FIG. 21 is a view of the lamination head showing the backing layercollection drum moved back to the collection drum home position andfurther illustrating the backing layer wound on the material supplydrum;

FIG. 22 is a view of the cutter platen taken along line 22-22 of FIG. 21and illustrating an example of a cutter blade moving across the backedmaterial along a blade angle path that is complementary to the materialfeed rate of the backed material;

FIG. 23 is a view of the cutter platen showing further progression ofthe cutter blade along the plate path angle to cut the layup materialalong an intended cut line;

FIG. 24 is a view of the cutter plotting showing still furtherprogression of the cutter plate during cutting of the layup materialalong the intended cut line oriented perpendicular to lengthwisedirection of the backed material;

FIG. 25 is a view of the cutter platen after cutting the backed materialalong the intended cut line;

FIG. 26 is a view of end example of the lamination head in which thebacking layer directional control device is configured as a translatingdevice movable between the neutral position, the first mode separationposition, and the second mode separation position;

FIG. 27 is a perspective view of an example of a lamination head havinga first lamination assembly mounted on a first side of the mountingframe and a second lamination assembly mounted on a second side of themounting frame which is pivotable about a vertical axis to allow thefirst lamination assembly to apply layup material to a substrate along afirst direction of travel and allow the second lamination assembly toapply layup material to the substrate along a second direction oftravel;

FIG. 28 is a flowchart of operations included in a method of threadinglayup material through a lamination head;

FIG. 29 is a flowchart of operations included in a method ofbi-directionally applying layup material onto a substrate.

DETAILED DESCRIPTION

Referring now to the drawings which illustrate preferred and variousembodiments of the disclosure, shown in FIG. 1 is perspective view of amanufacturing system 100 showing an example of a lamination head 140applying a course 178 of layup material 166 onto a substrate 118configured as a layup surface 116 of a layup tool 114 such as a mandrel.The lamination head 140 includes a material supply drum 160 which may bemounted to a mounting frame 142 which may be configured as a plate or asa skeleton or truss structure. The material supply drum 160 isconfigured to support a material roll 162 of backed material 164. Thebacked material 164 comprises a continuous strip of layup material 166(e.g., prepreg tape) backed by a strip of backing layer 168. Thelamination head 140 further includes a backing layer separation assembly220 configured to separate the backing layer 168 from the layup material166 and guide the layup material 166 toward the substrate 118. Inaddition, the lamination head 140 includes lamination head componentssuch as a cutter assembly 340 configured to cut the layup material 166as the lamination head 140 approaches each designated start location andend location of a course 178 of layup material 166. The lamination head140 additionally includes a backing layer collection drum 180 configuredto take up the backing layer 168 onto the backing layer collection drum180 after separation of the backing layer 168 from the layup material166.

In an embodiment, the lamination head 140 is configured to haveself-threading capability in which the backing layer 168 isautomatically (e.g., without manual intervention) threaded from thematerial roll 162 and through the lamination head components and ontothe backing layer collection drum 180, as described in greater detailbelow. Advantageously, the self-threading capability of the laminationhead 140 reduces lamination head downtime during the changeout ofmaterial rolls 162. The reduction in lamination head downtime reducesproduction flow time and allows a corresponding increase in thecomposite laminate 179 production rate. In addition, the self-threadingcapability of the lamination head 140 reduces production costs byeliminating the need for personnel to manually thread the backing layer168 through the lamination head 140 each time a material roll 162 ischanged out.

Additionally or alternatively, the lamination head 140 is configured tohave bi-directional layup capability in which the lamination head 140 isconfigured to apply layup material 166 to a substrate 118 in a firstdirection of travel 370 (FIG. 16) and also apply layup material 166 tothe substrate 118 in a second direction of travel 372 (FIG. 18) oppositethe first direction of travel 370, as described in greater detail below.Advantageously, the bi-directional capability of the lamination head 140reduces off-part movement of the lamination head 140 that wouldotherwise be required if the lamination head 140 were limited toapplying layup material 166 in a single direction of travel or if thelamination head 140 needed to be both lifted and rotated 180 degreesprior to applying layup material 166 in an opposite direction. Forexample, a lamination head 140 limited to laying up in a singledirection of travel requires the lamination head 140 to lift off of thelayup surface 116 at the end of each course 178 of layup material 166,move back over the layup surface 116 in a second direction of travel 372opposite the first direction of travel 370, and start applying anothercourse 178 of layup material 166 parallel to the previous course 178while moving along the first direction of travel 370. As may beappreciated, the bi-directional layup capability of the lamination head140 eliminates off-part movement along the second direction of travel372 which significantly reduces production flow time. In some examples,a lamination head 140 configured to have self-threading capability mayor may not be configured to have bi-directional layup capability, asdescribed below. In other examples, a lamination head 140 configured tohave bi-directional layup capability may or may not be configured tohave self-threading capability, as described below.

Referring to FIGS. 2-5, shown is an example of a lamination head 140supported on a gantry 104 for moving the lamination head 140 over alayup surface 116 configured as a mandrel. The gantry 104 may includeone or more elongated base members 102 supported on a surface such as afactory floor. The gantry 104 may include a generallyhorizontally-oriented gantry crossbeam 106 having opposing endsrespectively coupled to a pair of generally vertically-oriented beamsupports 110. Each one of the beam supports 110 may be supported on oneof the base members 102 via a gantry track 108 that extends along alengthwise direction of the base members 102. The beam supports 110 maybe movable along the gantry tracks 108 via one or more linear actuationmechanisms (not shown) for moving the lamination head 140 along alengthwise direction of the mandrel parallel to the gantry tracks 108.In addition, the lamination head 140 may be movable via a linearactuation mechanism (not shown) along a horizontal track (not shown)incorporated into the gantry crossbeam 106 for moving the laminationhead 140 along a transverse direction perpendicular to the gantry tracks108. Furthermore, the gantry crossbeam 106 may be vertically movable formoving the lamination head 140 along a vertical direction parallel to avertical axis 148 (FIGS. 4-5) of the lamination head 140. For example,the opposing ends of the gantry crossbeam 106 may be movable alongvertical tracks (not shown) via linear actuation mechanisms (not shown)that may be incorporated into the beam supports 110. Although thefigures illustrate a vertical axis 148 of the lamination head 140, theneed to rotate the lamination head 140 about the vertical axis 148during the laying up of a composite laminate is advantageously avoideddue to the bi-directional layup capability of the lamination head 140.However, the lamination head 140 may be rotated about the vertical axis148 to facilitate the performance of certain non-lamination activitiessuch as to provide improved access for performing maintenance on thehead components of the lamination head 140 or when replacing one or morematerial rolls 162 on the lamination head 140. A lamination head 140having self-threading capability but lacking bi-directional layupcapability as mentioned below may also be rotated about the verticalaxis 148 to provide the capability for dispensing layup material 166 inopposite directions.

Although shown supported by a gantry 104, the lamination head 140 may besupported by any one of a variety of arrangements including, but notlimited to, a robotic device, a cantilevered support system, arail-mounted system, or other arrangements. In addition, the laminationhead 140 is not limited to applying layup material 166 to a static layupsurface 116, and may include applying layup material 166 to a movableforming tool such as a translatable and/or rotatable mandrel. In afurther embodiment, the lamination head 140 may be fixed or non-movable,and the layup surface 116 or substrate 118 may be moved relative to thelamination head 140 as the lamination head 140 applies layup material166 to the substrate 118. In the present disclosure, the substrate 118may be the layup surface 116 of a layup tool 114, or the substrate 118may be a most recently applied layer of layup material 166.

In the present disclosure, movement of the lamination head 140 along theabove-mentioned lengthwise direction, the transverse direction and thevertical direction may be controlled by a controller 130 (FIG. 4)executing computable readable program instructions (e.g., a numericalcontrol program). In addition, the below-described movements of thelamination head components enabling self-threading of the laminationhead 140 may also be controlled by the controller 130 as may themovements of the lamination head components enabling bi-directionalapplication of layup material 166 onto a substrate 118. For example, thematerial supply drum 160 and the backing layer collection drum 180 (FIG.5) may each be actively rotatably driven by a motor (not shown)controlled by the controller 130. Alternatively, the material supplydrum 160 (and optionally the backing layer collection drum 180) may bepassively rotatably driven as a result of the movement of the layupmaterial 166 during dispensing onto the layup surface 116 or ontopreviously-applied layup material 166 once the layup material 166 istacked down. The below-described movement (e.g., translation) of thebacking layer collection drum 180 during threading of the laminationhead 140 may be facilitated by a linear actuation mechanism (not shown)such as a drive screw coupled to a servo motor that may be controlled bythe controller 130. The controller 130 may also control the cutting ofthe layup material 166 in coordination with controlling the backinglayer separation assembly 220 (FIG. 5) for separating the layup material166 from the backing layer 168 as the layup material 166 is applied tothe substrate 118 and the backing layer 168 is wound onto the backinglayer collection drum 180.

Referring to FIG. 6, shown is an example of a lamination head 140 priorto the threading of the backing layer 168 (FIG. 5) from the materialsupply drum 160 to the backing layer collection drum 180. As mentionedabove, the lamination head 140 includes a backing layer separationassembly 220 (FIG. 5) which is comprised of a backing layer separationdevice 222 and at least one backing layer separation mechanism 250, 270.In the example shown in the figures, the backing layer separation device222 is configured as a backing layer directional control device 224 thatis movable between a first mode separation position 304 (FIG. 16) and asecond mode separation position 306 (FIG. 18) which enablesbi-directional application of layup material 166 along a first directionof travel 370 (FIG. 16) and along a second direction of travel 372 (FIG.18) opposite the first direction of travel 370, as mentioned above.However, a lamination head 140 having self-threading capability may beconfigured without bi-directional layup capability, in which case thebacking layer separation device 222 limits the lamination head 140 toapplying layup material 166 to a substrate 118 while dispensing thelayup material 166 when moving along a single direction of travel (e.g.,a first direction of travel 370), and being incapable of dispensinglayup material 166 when moving along a second direction of travel 372opposite the first direction of travel 370.

In FIG. 6, the backing layer separation device 222 is movable from aseparation device home position 226 (FIG. 12) to a separation deviceengagement position 228 (FIG. 13) as part of the process of threadingthe backing layer 168 (FIG. 5) through the lamination head 140. Thecutter assembly 340 (FIG. 5) of the lamination head 140 includes acutter platen 342 and a cutter module 348. The cutter module 348 ismovable, under control of the controller 130, from a platen homeposition 344 to a platen engagement position 346 (FIG. 13) causing thebacking layer 168 to be captured between the cutter platen 342 and thecutter module 348. The movement of the cutter platen 342 from the platenhome position 344 to the platen engagement position 346 may be part ofthe process of threading the backing layer 168. In the platen engagementposition 346, the cutter platen 342 indexes to the cutter module 348.The cutter platen 342 may remain in the platen engagement position 346as layup material 166 is dispensed from the lamination head 140. Thecutter platen 342 may be commanded to return to the platen home position344 when the material roll 162 is depleted of layup material 166 toallow the material roll 162 to be replaced as described below. When thecutter platen 342 is in the platen engagement position 346, the cuttermodule and cutter platen 342 cooperate to cut the layup material 166upon command by the controller 130. The cutter module 348 and cutterplaten 342 may cut the layup material 166 as the backing layer 168passes through the cutter assembly 340, as described in greater detailbelow. The cutter module 348 and cutter platen 342 cooperate to cut thelayup material 166 without cutting completely through the backing layer168 in order to allow tension to be maintained along the length of thebacking layer 168 during the dispensing of layup material 166 from thelamination head 140.

As mentioned above, the material supply drum 160 is configured tosupport a material roll 162 of backed material 164 comprising acontinuous strip of layup material 166 backed by a backing layer 168.The layup material 166 may be a fiber-reinforced polymer matrix materialsuch as pre-impregnated resin tape. The fibers in the tape may beunidirectional or the fibers may be arranged as a woven fabric. Thelayup material 166 may be provided in any one of a variety ofthicknesses and widths. For example, the layup material 166 may beprovided as prepreg tape in thicknesses of 0.007 inch or more and inwidths of 9-12 inches although the layup material 166 may be provided inthicknesses greater than 0.007 inch and/or in widths narrower than 9inches or wider than 12 inches. The polymer matrix material may be athermosetting resin or a thermoplastic resin. The fibers may be carbonfibers or the fibers may be formed of alternative materials such asglass, boron, aramid, ceramic or other non-metallic materials ormetallic materials. In some examples, the material supply drum 160 maybe configured to support a material roll 162 of non-composite material.For example, the material roll 162 may include layup material 166 (e.g.,backed by a backing layer 168) such as metallic foil or metallic meshand which may be applied by the lamination head 140 before, during,and/or after the laying up of composite plies of a composite laminate179 (FIG. 1).

Referring to FIGS. 6-7, the lamination head 140 includes theabove-mentioned backing layer collection drum 180 which is configured totake up the backing layer 168 during separation of the backing layer 168from the layup material 166 as the layup material 166 is applied to thesubstrate 118. To initiate self-threading of the lamination head 140,the backing layer collection drum 180 is configured to move from acollection drum home position 182 (FIG. 6) to a collection drumengagement position 184 (FIG. 7) proximate the material roll 162 asmounted on the material supply drum 160. In the example shown, thebacking layer collection drum 180 is translated horizontally along alinear path to initiate threading of the backing layer 168. As analternative to linear movement, the lamination head 140 may beconfigured such that the backing layer collection drum 180 moves along anon-linear path or along an arcuate path from the collection drum homeposition 182 to the collection drum engagement position 184. In thecollection drum engagement position 184, the backing layer collectiondrum 180 is configured to engage the backing layer leading edge 170 ofthe backing layer 168. For example, the backing layer collection drum180 may be configured to physically contact and positively engage thebacking layer leading edge 170 (FIG. 8) on the material supply drum 160.Upon engaging the backing layer leading edge 170, the backing layercollection drum 180 is configured to translate, under control of thecontroller, from the collection drum engagement position 184 back to thecollection drum home position 182 while dispensing a threadable portion172 of the backing layer 168 (or backing layer 168 plus the leadingportion of the layup material 166) between the material supply drum 160and the backing layer collection drum 180 as shown in FIG. 12.

Prior to and/or during engagement of the backing layer collection drum180 with the backing layer leading edge 170, the controller 130 may beconfigured to rotate the material supply drum 160 and/or the backinglayer collection drum 180 such that the backing layer leading edge 170is aligned with a backing layer pick element 190 which may be includedwith the backing layer collection drum 180. During movement of thebacking layer collection drum 180 back to the collection drum homeposition 182, the controller 130 may rotate the material supply drum 160in synchronization with rotation of the backing layer collection drum180 to maintain a predetermined amount of tension within the threadableportion 172 of the backing layer 168. In some examples, the controller130 may synchronize the rotation of the material supply drum 160 and thebacking layer collection drum 180 to wind a certain amount (e.g., atleast one complete wrap) of backing layer 168 onto the backing layercollection drum 180 as a means for securing the backing layer 168 to thebacking layer collection drum 180 prior to proceeding with the threadingof the layup material 166 through the lamination head 140. The amount ofbacking layer 168 wound onto the backing layer collection drum 180 maybe dictated in part by the level of tension applied to the backing layer168 and/or the level of friction between the backing layer 168 and thebacking layer collection drum 180 required to avoid rotational slippingof the backing layer 168 on the backing layer collection drum 180.

FIG. 8 shows an example of a backing layer pick element 190 that may beincluded with the backing layer collection drum 180. As mentioned above,the backing layer pick element 190 is configured to engage the backinglayer leading edge 170 on the material roll 162. After the backing layerpick element 190 is engaged to the backing layer leading edge 170, thebacking layer collection drum 180 moves, under command of the controller130, from the collection drum engagement position 184 in FIG. 6) back tothe collection drum home position 182 (FIG. 7) thereby pulling thebacking layer leading edge 170 away from the material supply drum 160.

FIG. 9 shows an example of the layup material 166 and the backing layer168 that make up the backed material 164 that is wound on the materialroll 162. The outermost wraps of the material roll 162 are typicallybacking layer 168 only (i.e., a backing-layer-only portion) without anylayup material 166. For example, the material roll 162 may be providedwith an additional several feet (e.g., up to 15 feet) ofbacking-layer-only portion at the beginning of a material roll 162. Thebacking layer 168 may be formed of any material that prevents adjacentwraps of layup material 166 from sticking to each other. For example,the backing layer 168 may be paper that is silicone-coated on one side,or the backing layer 168 may be a thin plastic film such as polyethylenefilm.

Referring back to FIG. 8, shown is the backing layer pick element 190configured as a magnet 192 for magnetic attachment to a magnetic element194 that may be mounted to the backing layer leading edge 170 on thematerial roll 162. The magnetic element 194 may be a steel mesh or othertype of magnetic or ferrous material. The magnetic element 194 ispreferably flexible. In the example shown, the magnetic element 194 maybe coupled to the radial inner side of the backing layer 168 at thebacking layer leading edge 170. For example, the magnetic element 194may be adhered to the radial inner side of the backing layer 168 using afirst layer of double-sided adhesive tape 196. A second layer ofdouble-sided adhesive tape 196 may be installed on a radial inner sideof the magnetic element 194 for securing the backing layer leading edge170 to the material roll 162 such that the magnetic element 194 issandwiched between the first and second layers of double-sided adhesivetape 196. The second layer of double-sided adhesive tape 196 may beprovided with relatively high tack or adhesion on the side facing themagnetic element 194, and relatively low tack or adhesion on the sidefacing the material roll 162. In this manner, the second layer ofdouble-sided adhesive tape 196 remains with the magnetic element 194 asthe backing layer leading edge 170 is pulled away from the material roll162. The combination of the magnetic element 194 and double-sidedadhesive tape 196 provides an arrangement that allows for the magnet 192of the backing layer pick element 190 to magnetically engage themagnetic element 194 on the backing layer leading edge 170 during theinitiation of self-threading, and also provides a mechanism for securingthe backing layer 168 after being wound back onto the material supplydrum 160 (e.g., FIG. 21) after the layup material 166 is depleted, asdescribed below.

FIG. 10 shows an example of the backing layer pick element 190configured as a vacuum nozzle 198 for vacuum engagement to the radialouter surface of the backing layer leading edge 170. The vacuum nozzle198 may be fluidly coupled to a vacuum source 200 such as a vacuum pumpthat may be included with the manufacturing system 100. The fluidcoupling (not shown) between the vacuum nozzle 198 and the vacuum pumpmay extend through a shaft (not shown) of the backing layer collectiondrum 180. The vacuum source 200 may be activated once the backing layercollection drum 180 is in the collection drum engagement position 184(FIG. 7) and the backing layer collection drum 180 has been rotated suchthat the vacuum nozzle 198 is aligned with the backing layer leadingedge 170. For the arrangement of FIG. 10, a single layer of double-sidedadhesive tape 196 may secure the backing layer leading edge 170 to thematerial roll 162 until the vacuum nozzle 198 engages the radial outersurface of the backing layer leading edge 170 and pulls the backinglayer leading edge 170 away from the material roll 162 as the backinglayer collection drum 180 is moved from the collection drum engagementposition 184 (FIG. 7) back to the collection drum home position 182(FIG. 12). The double-sided adhesive tape 196 may be provided withrelatively high tack on the radial inner side and relatively low tack onthe radial outer side of the double-sided adhesive tape 196. In thismanner, the double-sided adhesive tape 196 will remain with the materialroll 162 as the backing layer leading edge 170 is pulled away from thematerial roll 162.

FIG. 11 is an example of the backing layer pick element 190 configuredas a hook element 202 or a loop element 204 (e.g., Velcro™) configuredto engage a corresponding loop element 204 or hook element 202 mountedon the radial outer side of the backing layer leading edge 170. Similarto the above-described arrangement of the vacuum nozzle 198, the backinglayer leading edge 170 in FIG. 11 may be secured to the material roll162 by means of a single piece of double-sided adhesive tape 196. Thedouble-sided adhesive tape when 96 may be configured with high tack onthe radial inner side and low tack on the radial outer side in the samemanner described above with regard to FIG. 10.

FIG. 12 shows the backing layer collection drum 180 after moving fromthe collection drum engagement position 184 (FIG. 7) to the collectiondrum home position 182 while dispensing the threadable portion 172 ofthe backing layer 168 between the material supply drum 160 and thebacking layer collection drum 180. As mentioned above, movement of thebacking layer collection drum 180 may be facilitated by a linearactuation mechanism (not shown) such as a drive screw rotated by a motorthat is controlled by the controller 130 (FIG. 4). The controller 130may also be configured to control the rotation of the material supplydrum 160 and/or the backing layer collection drum 180 to maintain apredetermined level of tension in the threadable portion 172 duringmovement of the backing layer collection drum 180 from the collectiondrum engagement position 184 to the collection drum home position 182.

In FIG. 12, the threadable portion 172 of the backing layer 168 extendsbetween the backing layer directional control device 224 (i.e., thebacking layer separation device 222) and the at least one backing layerseparation mechanism which, in the figures, is illustrated as a firstbacking layer separation mechanism 250 and a second backing layerseparation mechanism 270. For example, the backing layer directionalcontrol device 224 is shown located above the threadable portion 172 andthe first backing layer separation mechanism 250 and second backinglayer separation mechanism 270 are shown located below the threadableportion 172. Similarly, the threadable portion 172 extends between thecutter platen 342 and the cutter module 348. For example, the cutterplaten 342 is shown located above the threadable portion 172 and thecutter module 348 is shown located below the threadable portion 172.

FIG. 13 shows the cutter platen 342 translated from the platen homeposition 344 to the platen engagement position 346. The verticallydownward movement of the cutter platen 342 may be effectuated by alinear actuation mechanism (not shown) that may be controlled by thecontroller 130. Also shown is the backing layer directional controldevice 224 translated from the separation device home position 226 to aseparation device engagement position 228. The vertically downwardmovement of the backing layer directional control device 224 may also beeffectuated by a linear actuation mechanism (not shown) that may becontrolled by the controller 130. During the vertically downwardmovement, the cutter platen 342 and the backing layer directionalcontrol device 224 engage or contact the threadable portion 172 of thebacking layer 168 and drive the backing layer 168 downwardlyrespectively toward the cutter module 348 and the first and secondbacking layer separation mechanisms 250, 270. As the threadable portion172 of the backing layer 168 is pulled downwardly, the controller 130may control rotation of the material supply drum 160 and/or the backinglayer collection drum 180 to maintain a predetermined level of tensionin the threadable portion 172. The cutter platen 342 indexes to thecutter module 348 and the backing layer 168 is captured between thecutter platen 342 and the cutter module 348. The indexing of the cutterplaten 342 to the cutter module 348 may be facilitated by a pin-stylearrangement (not shown) or by optical laser guidance for preciselyaligning the cutter platen 342 to the cutter module 348 to allow forprecise control of the cutting depth of the cutter blade 350(schematically illustrated in FIGS. 22-25) of the cutter module 348 tocut only the layup material 166 and leaving the backing layer 168intact.

In FIG. 13, the backing layer directional control device 224 is shown inthe separation device engagement position 228 which is in proximity tothe first and second backing layer separation mechanisms 250, 270. Inthe separation device engagement position 228, the backing layerdirectional control device 224 may be in a neutral position 300 in whichthe backing layer directional control device 224 places the backinglayer 168 is in non-aligned relation to either one of the first andsecond backing layer separation mechanisms 250, 270. In this regard,when the backing layer directional control device 224 is in the neutralposition 300, the backing layer 168 is located such that neither thefirst backing layer separation mechanism 250 nor the second backinglayer separation mechanism 270 is capable of separating the layupmaterial 166 from the backing layer 168. The neutral position 300 mayadvantageously provide clearance and access to the first and secondbacking layer separation mechanisms 250, 270 such as for maintenance.

In FIG. 13, the backing layer directional control device 224 may bemoved from the neutral position 300 to either a first mode separationposition 304 (FIG. 15) or to a second mode separation position 306 (FIG.17). In the first mode separation position 304, the backing layerdirectional control device 224 places the backing layer 168 in alignmentwith the first backing layer separation mechanism 250, causing the firstbacking layer separation mechanism 250 to engage a layup materialleading edge 174 (e.g., FIG. 25) of the layup material 166 when thebacked material 164 is fed through the lamination head 140. The layupmaterial leading edge 174 may be located at the tail end (not shown) ofthe above-mentioned backing-layer-only portion at the beginning of thematerial roll 162. The layup material leading edge 174 may also be theresult of the cutter assembly 340 (i.e., the cutter platen 342 andcutter module 348) cutting the layup material 166 as the backed material164 is fed through the lamination head 140, as described below withregard to FIGS. 22-25. As mentioned above, the cutter platen 342 remainsin the platen engagement position 346 as layup material 166 is dispensedfrom the lamination head 140. The cutter module and cutter platen 342cooperate to cut the layup material 166 upon command by the controller130. When the backing layer directional control device 224 is in thesecond mode separation position 306 (FIG. 17), the backing layerdirectional control device 224 places the backing layer 168 in alignmentwith the second backing layer separation mechanism 270, causing thesecond backing layer separation mechanism 270 to engage the layupmaterial leading edge 174 as the backed material 164 is fed through thelamination head 140.

In the figures, the lamination head 140 is shown having a first backinglayer separation mechanism 250 and a second backing layer separationmechanism 270 and the backing layer separation device 222 is configuredas a backing layer directional control device 224 movable between thefirst mode separation position 304 and the second mode separationposition 306 and which allows for bi-directional application of thelayup material 166 onto a substrate 118, as described in greater detailbelow. However, for the above-mentioned embodiment of a lamination head140 having self-threading capability but lacking bi-directional layupcapability, the lamination head 140 may include a single backing layerseparation mechanism such as only a first backing layer separationmechanism 250 and not having a second backing layer separation mechanism270, and the lamination head 140 may include a backing layer separationdevice 222 that is limited to a first mode separation position 304 andlacks a second mode separation position 306. In such an example, duringthreading of the layup material 166, the backing layer separation device222 moves from the separation device home position 226 (FIG. 12) to theseparation device engagement position 228 (FIG. 13) which may be aneutral position 300 as described above. Alternatively during threadingof the layup material 166, the backing layer separation device 222 maybe moved from the separation device home position 226 to a separationdevice engagement position 228 that places the backing layer 168 inalignment with a single backing layer separation mechanism (e.g., thefirst backing layer separation mechanism 250) for engaging the layupmaterial leading edge 174 as the backed material 164 is fed through thelamination head 140 to cause the layup material 166 to be applied to thesubstrate 118.

In the above-mentioned embodiment of a lamination head 140 havingbi-directional layup capability but lacking self-threading capability,the backing layer collection drum 180 may be rotatably fixed in positionat the collection drum home position 182 (FIG. 13), and the laminationhead 140 may lack a collection drum engagement position 184 (FIG. 7)otherwise required for self-threading capability. Similarly, the cutterplaten 342 may be fixed in position at the platen engagement position346 (FIG. 13), and the lamination head 140 may lack a platen homeposition 344 (FIG. 12) otherwise required for self-threading capability.In addition, the backing layer separation device 222 comprises a backinglayer directional control device 224 (FIG. 13) positioned at theseparation device engagement position 228 (FIG. 13), and the laminationhead 140 may lack a separation device home position 226 (FIG. 7)otherwise required for self-threading capability.

FIG. 14 is a sectional view of a portion of the lamination head 140taken along line 14 of FIG. 13 at the location of the backing layerdirectional control device 224. FIG. 14 shows an example of a laminationhead 140 in which the backing layer directional control device 224 ismovable from the neutral position 300 in which the backing layerdirectional control device 224, to a retracted position 302 in which thebacking layer directional control device 224 is inside the laminationhead 140. The backing layer directional control device 224 may bemovable into the retracted position 302 prior to the above-describedprocess of threading the backing layer 168 through the lamination head140. Advantageously, moving the backing layer directional control device224 into the retracted position 302 inside the lamination head 140 mayprovide additional clearance and access to the first backing layerseparation mechanism 250 and the second backing layer separationmechanism 270 such as for maintenance purposes.

FIG. 15 shows the backing layer directional control device 224 movedfrom the neutral position 300 (FIG. 13) to the first mode separationposition 304. In the example shown, the backing layer directionalcontrol device 224 is configured as a pivoting device 310 having aproximal end 312 and a distal end 314. The pivoting device 310 ispivotable about the proximal end 312 to move the distal end 314 betweenthe neutral position 300 (FIG. 13), the first mode separation position304 (FIGS. 15-16) and the second mode separation position 306 (FIGS.17-18). When moved into the first mode separation position 304, thedistal end 314 of the pivoting device 310 positions the backed material164 into alignment with the first backing layer separation mechanism250. Likewise, as shown in FIGS. 17-18 and described below, when movedinto the second mode separation position 306, the distal end 314 of thepivoting device 310 positions the backed material 164 into alignmentwith the second backing layer separation mechanism 270.

Referring to FIG. 16, shown is a magnified view of a lower portion ofthe lamination head 140 illustrating the pivoting device 310 configuredas a roller mechanism having a proximal belt roller 316 and a distalbelt roller 318 spaced apart from each other and surrounded by acontinuous roller belt 319. The roller belt 319 is configured tocirculate around the proximal and distal rollers 316, 318 as the backinglayer 168 moves along the roller belt 319. Alternatively, the pivotingdevice 310 may be formed as a unitary structure in which the distal end314 has a static surface which the backing layer 168 slides over.Although FIG. 16 shows the backing layer directional control device 224as a pivoting device 310, the backing layer directional control device224 may be provided in alternative configurations such as a translatingdevice 320 as described below and illustrated in FIG. 26.

FIG. 16 shows the backing layer directional control device 224 in thefirst mode separation position 304 and aligned with the first backinglayer separation mechanism 250 for separating the backing layer 168 fromthe layup material 166 for applying the layup material 166 to thesubstrate 118 as the lamination head 140 moves along a first directionof travel 370. The first backing layer separation mechanism 250 has afirst backing layer separator 252 and a first guide member 256.Likewise, FIG. 18 shows the second backing layer separation mechanism270 having a second backing layer separator 272 and a second guidemember 276. The first backing layer separator 252 and the second backinglayer separator 272 respectively have a first and second separator edge254, 274 configured to separate the backing layer 168 from the layupmaterial 166 and guide the layup material 166 toward the substrate 118.The first and second separator edge 254, 274 may be positioned in closeproximity to the backed material 164 depending on whether the backinglayer directional control device 224 in the first mode separationposition 304 (FIG. 16) or the second mode separation position 306 (FIG.18) for respectively causing the first or second separator edge 254, 274to engage the layup material leading edge 174 (FIG. 25) as the backedmaterial 164 moves through the lamination head 140. The first guidemember 256 has a first guide surface 258 and the second guide member 276has a second guide surface 278. Each guide surface 258, 278 may beoriented non-perpendicular to the layup material 166 to support thelayup material 166 after separation of the layup material 166 from thebacking layer 168 and guide the layup material 166 onto the substrate118. In FIG. 18, the portion of the second separator edge 274 nearestthe distal end 314 of the backing layer directional control device 224is preferably oriented approximately parallel to a tangent to the distalend 314 at the location where the layup material 166 separates from thebacking layer 168 as the backing layer 168 moves around the distal end314.

Referring to FIGS. 16 and 18, in some examples, the first guide member256 of the first backing layer separation mechanism 250 and/or thesecond guide member 276 of the second backing layer separation mechanism270 may be pivotably adjustable for respectively adjusting a first pitchangle 260 (FIG. 16) or a second pitch angle 280 (FIG. 18) respectivelyof the first guide surface 258 (FIG. 16) and the second guide surface278 (FIG. 18). The first and second pitch angle 260, 280 respectively ofthe first and second guide surface 278 is measured relative to theportion of the layup material 166 immediately upstream respectively ofthe first and second guide member 256, 276. The first and second pitchangle 260, 280 respectively of the first and second guide surface 258,278 may be larger for a layup material 166 having a relatively highaxial stiffness than the first and second pitch angle 260, 280 for alayup material 166 having a relatively low axial stiffness. The axialstiffness of layup material 166 may be primarily a function of the fiberorientation within the layup material. For example, the axial stiffnessof layup material 166 having unidirectional reinforcing fibers (notshown) may be higher than the axial stiffness of layup material 166having woven reinforcing fibers (not shown). The level of adhesion ortack between the layup material 162 and the backing layer 168 may alsohave a significant impact on the first and second pitch angle 260, 280respectively selected for the first and second guide surface 278. Forexample, in FIG. 16, a relatively high level of adhesion between thelayup material 162 and the backing layer 168 may result in the layupmaterial 162 separating from the backing layer 168 at a location furtherdownstream on the outer circumference of the distal end 314 of thebacking layer directional control device 224, which may dictate a largerfirst pitch angle 260 for the first guide surface 258 than the pitchangle required for a relatively low level of adhesion between the layupmaterial 162 and the backing layer 168.

In the present disclosure, the portion of the backing layer separationdevice 222 (e.g., the backing layer directional control device 224)nearest the backing layer 168 may have a relatively small radius. Thelayup material 166 may have a higher axial stiffness compared to theaxial stiffness of the backing layer 168 such that when the backedmaterial 164 moves around the relatively small radius of the backinglayer separation device 222, the bond strength between the layupmaterial 166 and the backing layer 168 is exceeded causing the layupmaterial leading edge 174 to peel away from the backing layer 168 andresulting in the layup material 166 separating from the backing layer168. The first or second separator edge 254, 274 may engage the layupmaterial leading edge 174 without contacting the backing layer 168. Theengagement of the first or second separator edge 254, 274 with the layupmaterial leading edge 174 may assist in peeling the layup material 166away from the backing layer 168 and directing the layup material 166respectively toward the first or second guide surface 258, 278,depending on whether the backing layer directional control device 224 isin the first mode separation position 304 or the second mode separationposition 306.

The cutter blade 350 (FIGS. 21-25) of the cutter module 348 may beconfigured to cut the layup material 166 preferably without cutting thebacking layer 168. The cutter module 348 may be manually pre-adjustedand/or controlled by the controller 130 to cut the backing layer 168.The controller 130 commands the cutter module 348 to cut the layupmaterial 166 in coordination with the approaching start of a new course178 (FIG. 1) of layup material 166 to be applied to the substrate 118.In addition, the controller 130 commands the cutter module to cut thelayup material 166 in coordination with the approaching end of a course178 of layup material 166 currently being applied to the substrate 118.As mentioned above, the cutting of the layup material 166 by the cuttermodule 348 creates a layup material leading edge 174 (FIG. 25) and alayup material trailing edge 176 (FIG. 25) which abuts or faces thelayup material leading edge 174.

Referring still to FIG. 16, when the lamination head 140 is moving alongthe first direction of travel 370 and approaches a predeterminedlocation of a start of a new course 178 (FIG. 1) of layup material 166to be applied to the substrate 118, the first separator edge 254 of thefirst backing layer separator 252 engages the layup material leadingedge 174 and diverts the layup material 166 toward the first guidesurface 258 of the first guide member 256 which guides the layupmaterial 166 onto the substrate 118. When the lamination head 140approaches a predetermined location of the end of the course 178 oflayup material 166 while moving along the first direction of travel 370,the cutter module 348 makes another cut (FIG. 25) in the layup material166. Prior to the cut reaching the first backing layer separator 252,the backing layer directional control device 224 and/or the firstbacking layer separator 252 may optionally be moved slightly away fromthe backed material 164 which allows the layup material trailing edge176 of the cut to continue over the first guide member 256, and alsoprevents the first separator edge 254 from engaging the layup materialleading edge 174 which thereby prevents the layup material 166 locatedupstream of the layup material leading edge 174 from following the layupmaterial trailing edge 176 over the first guide surface 258 and onto thesubstrate 118. Instead, a short section (not shown) of layup material166 located upstream of the layup material leading edge 174 remainsadhered to the backing layer 168 and moves with the backing layer 168toward the backing layer collection drum 180. In anticipation of a newcourse 178 of layup material 166 being applied to the substrate 118after the lamination head 140 reverses direction to move along thesecond direction of travel 372, the cutter module 348 makes another cut(FIG. 25) in the layup material 166, and the backing layer directionalcontrol device 224 moves from the first mode separation position 304 asshown in FIG. 16 to the second mode separation position 306 as shown inFIGS. 17-18. The cut that is made in anticipation of the new coursedefines the layup material trailing edge 176 of the above-mentionedshort section of layup material 166 that is ultimately wound withbacking layer 168 onto the backing layer collection drum 180. The cutmade in anticipation of the new course also defines the layup materialleading edge 176 of the new course.

A short section of layup material 166 is ultimately wound onto thebacking layer collection drum 180 each time the lamination head 140reaches the end of a course 178 along the first direction of travel 370and reverses direction to start a new course 178 along the seconddirection of travel 372. More specifically, each short section of layupmaterial 166 is generated as a result of the distal end 314 of thebacking layer directional control device 224 moving upstream along thebacked material 164 from the first mode separation position 304 (e.g.,which may define the approximate location of the cut defining the end ofa most recent course) to the second mode separation position 306 (e.g.,which may define the approximate location of the cut defining the startof a new course) while the backed material 164 is either stopped orcontinues to move through the lamination head 140 in a normal downstreamdirection toward the backing layer collection drum 180. In this regard,the length of each short section may be approximately equal to thedistance between the distal end 314 of the backing layer directionalcontrol device 224 in the first mode separation position 304 and thedistal end 314 in the second mode separation position 306. However, ifthe backed material 164 can be temporarily reversed in direction to movein an upstream direction toward the material supply drum 160 when a cutin the layup material 166 reaches the first mode separation position 304of the distal end 314, then the layup material leading edge 170 definedby the cut can be moved upstream to the location of the second modeseparation position 306 of the distal end 314. Temporarily moving thebacked material 164 in an upstream direction to move the layup materialleading edge 170 to the second mode separation position 306 allows thesecond separator edge 274 to engage the layup material leading edge 170when the backed material is again reversed to move in the normaldownstream direction, and thereby directing the layup material 166 ontothe second guide member 276 to start a new course 178, and avoiding thegeneration of the above-mentioned short section of layup material.

Referring to FIG. 17-18, shown is the backing layer directional controldevice 224 in the second mode separation position 306. In the exampleshown, the second guide member 276 and the second backing layerseparator 272 are formed as a unitary structure. However, the secondguide member 276 and the second backing layer separator 272 may beseparate components similar to the separate arrangement of the firstguide member 256 and first backing layer separator 252. As shown in FIG.18, the second backing layer separator 272 is located adjacent to thebacking layer 168 and the second guide member 276 is located downstreamof the second backing layer separator 272. The second guide surface 278of the second guide member 276 may be curved for redirecting the layupmaterial 166 into the appropriate orientation for being applied to thesubstrate 118 as the lamination head 140 moves along the seconddirection of travel 372 opposite the first direction of travel 370(FIGS. 15-16). As described above, the unitary structure of the secondguide member 276 and second backing layer separator 272 may be pivotablyadjustable for adjusting a second pitch angle 280 of the second guidesurface 278 based upon the axial stiffness of the layup material 166 andthe level of adhesion between the layup material 166 and the backinglayer 168.

In FIG. 18, shown is a magnified view of the lower portion of thelamination head 140 illustrating the backing layer directional controldevice 224 aligned with the second backing layer separation mechanism270 for separating the backing layer 168 from the layup material 166while the layup material 166 is applied to the substrate 118 as thelamination head 140 moves along the second direction of travel 372. Asmentioned above, as the backed material 164 moves around the relativelysmall radius of the backing layer directional control device 224, thesecond separator edge 274 of the second backing layer separator 272engages the layup material leading edge 174 as the layup materialleading edge 174 peels away from the backing layer 168. The secondbacking layer separator 272 directs the layup material 166 toward thesecond guide surface 278 of the second guide member 276 which guides thelayup material 166 onto the substrate 118 while the lamination head 140moves along the second direction of travel 372.

As described above with regard to FIG. 16, when the lamination head 140approaches a predetermined location of the end of the course 178 oflayup material 166 while moving along the second direction of travel372, the cutter module 348 cuts the layup material 166 to form a layupmaterial trailing edge 176 (FIG. 25) for the currently applied course178 of layup material 166. Prior to the cut reaching the second backinglayer separator 272, the backing layer directional control device 224and/or the second backing layer separator 272 (and second guide member276) may be moved slightly away from the backed material 164 to allowthe layup material trailing edge 176 to continue over the second guidemember 276, and thereby prevent the second separator edge 274 of thesecond backing layer separator 272 from engaging the layup materialleading edge 174.

As shown in FIGS. 15-19, the lamination head 140 may include a firstcompaction device 262 located downstream of the first guide member 256.The first compaction device 262 may apply compaction pressure onto thelayup material 166 against the substrate 118 as the lamination head 140moves along the first direction of travel 370. The lamination head 140may also include a second compaction device 282 located downstream(relative to the feed direction of the layup material 166) of the secondguide member 276. The second compaction device 282 may apply compactionpressure onto the layup material 166 as the lamination head 140 movesalong the second direction of travel 372. The first compaction device262 and/or the second compaction device 282 may be provided in any one avariety of configurations including, but not limited to, a compactionroller, a compaction shoe, a compaction bladder or other configurationsfor compacting the layup material 166 onto the substrate 118.

The lamination head 140 may also include one or more redirect rollers210 to maintain tension in the backed material 164 during theapplication of layup material 166 to the substrate 118. The one or moreredirect rollers 210 may maintain tension in the backed material 164while accommodating movement of the backing layer directional controldevice 224 between the first mode separation position 304, the neutralposition 300, and the second mode separation position 306. Thelamination head 140 may include additional components such as one ormore heaters (not shown) such as an infrared heater, a laser heater, ora hot air heater for locally heating the layup material 166 and/orlocally heating the substrate 118 just prior to application of the layupmaterial 166 onto the substrate 118. Local heating of the layup material166 and/or the substrate 118 may increase the tack of the layup material166 to thereby improve the adhesion of the layup material 166 to thesubstrate 118.

Referring to FIG. 19, shown is the backing layer separation device 222which is configured to move (e.g., translate), under control of thecontroller 130, from the separation device engagement position 228 (FIG.18) to the separation device home position 226 (FIG. 19) after thematerial roll 162 on the material supply drum 160 is, for example,depleted of layup material 166 (FIG. 12). However, a material roll 162may be replaced of any number of reasons, including changing out amaterial roll 162 for a material roll 162 of a different materialconfiguration, or changing out a material roll 162 upon exceeding itsallotted outtime, or if the remaining length of layup material 166 onthe material roll 162 is insufficient to enable the lamination head 140to apply the layup material 166 onto the substrate 118. The cutterplaten 342 is configured to move (e.g., translate), under control of thecontroller 130, from the platen engagement position 346 (FIG. 18) to theplaten home position 344 (FIG. 19) either simultaneously with themovement of the backing layer separation device 222 and/or before orafter movement of the backing layer separation device 222 to theseparation device home position 226. Also shown is a lengthwise portionof either backing layer 168 or backed material 164 (i.e., layup material166 backed by backing layer 168) extending between the material roll 162(depleted) and the backing layer collection drum 180 which maypredominantly contain backing layer 168. The controller 130 may rotatethe backing layer collection drum 180 and the material supply drum 160in a manner to maintain tension within the length of backed material 164extending between the backing layer collection drum 180 and the materialsupply drum 160 as the backing layer separation device 222 and thecutter platen 342 moved respectively back to the separation device homeposition 226 and platen home position 344.

As shown in FIG. 20, the backing layer collection drum 180 is configuredto move (e.g., translate) from the collection drum home position 182 tothe collection drum engagement position 184 proximate the materialsupply drum 160 to enable transferring or respooling of the backinglayer 168 (predominantly) from the backing layer collection drum 180 tothe material supply drum 160. During movement of the backing layercollection drum 180 to the collection drum engagement position 184, thecontroller 130 may control the rotation of the material supply drum 160and the backing layer collection drum 180 in a manner to avoid thebuildup of slack in the lengthwise portion of the backing layer 168 orbacked material 164. The controller 130 may control the rotation of thebacking layer collection drum 180 and material supply drum 160 to windor respool the backing layer 168 from the backing layer collection drumonto the material supply drum 160.

As shown in FIG. 21, after the backing layer 168 is wound or respooledonto the material supply drum 160, the backing layer collection drum 180is configured to move, under command of the controller 130, from thecollection drum engagement position 184 (FIG. 20) back to the collectiondrum home position 182. The material roll 162 containing primarilybacking layer 168 may then be removed from the material supply drum 160and replaced with a new material roll 162 of the same or differentbacked material 164. Removal and replacement of a material roll 162 maybe manually performed by an operator or technician. Alternatively,removal and replacement of a material roll 162 may be autonomouslyperformed (i.e., without human intervention) by a material reloadingsystem (not shown) that may be included with the manufacturing system100 (FIGS. 2-3). As an alternative to winding or respooling the backinglayer 168 onto the material supply drum 160, the backing layercollection drum 180 may remain in the collection drum home position 182after depletion of the material roll 162, and the roll of backing layer168 may be manually or autonomously removed from the backing layercollection drum 180. A new material roll 162 may then be loaded onto thematerial supply drum 160 and the lamination head 140 may be prompted forself-threading as described above.

Referring to FIGS. 22-25, shown is the progression of a cut being formedin the layup material 166 as the backed material 164 moves at a materialfeed rate 360 through the cutter assembly 340. FIG. 22 is a view of thecutter platen 342 showing an example of a cutter blade 350 at a startlocation of an intended cut line 358 prior to the cutter blade 350moving across the backed material 164 along a blade path angle 352. Asmentioned above, the cutter module 348 may include one or more cutterblades 350 for cutting the layup material 166 as the backing layer 168slides along the surface of the cutter platen 342. Movement of thecutter blade 350 may be controlled by the controller 130. In anembodiment not shown, the cutter module 348 may be configured to move atleast one cutter blade 350 along at least two axes (not shown) forforming complex cuts (e.g., non-straight cuts) in the layup material 166as the backed material 164 moves through the cutter assembly 340. Forexample, instead of limiting movement of the cutter blade 350 tostraight-line movement as shown in FIGS. 22-25, the cutter module 348may be configured to pivot the cutter blade 350 while moving the cutterblade 350 across the width of the backed material 164.

FIGS. 23-24 shows the cutter blade 350 moving along the blade path angle352 at a blade speed defining a blade travel vector 354 for cutting thelayup material 166 along the intended cut line 358. The cutter blade 350moves across the material width at a blade travel vector 354 having alongitudinal component 356 that is parallel to the lengthwise directionof the backed material 164. The longitudinal component 356 of the bladetravel vector 354 is proportional to the material feed rate 360.

FIG. 25 shows the cut formed in the layup along the intended cut line358. The depth of the cutter blade 350 is controlled such that thebacking layer 168 may remain at least partially intact during thecutting of the layup material 166. In the example shown, the intendedcut line 358 is oriented perpendicular to the lengthwise direction ofthe backed material 164. For an intended cut line 358 orientedperpendicular to the lengthwise direction of the backed material 164,the longitudinal component 356 of the blade travel vector 354 isequivalent to the material feed rate 360. For an intended cut line 358oriented non-perpendicular (not shown) to the lengthwise direction ofthe backed material 164, the longitudinal component 356 of the bladetravel vector 354 is either less than or greater than the material feedrate 360. Advantageously, moving the cutter blade 350 along theabove-described blade travel vector 354 enables the layup material 166to be cut without stopping the application of layup material 166 to thesubstrate 118. In this regard, cutting the layup material 166 while thelamination head 140 continues to apply layup material 166 to thesubstrate 118 increases the production rate relative to a conventionallamination head (not shown) that must temporarily stop laying up layupmaterial 166 each time it is necessary to make a cut in the layupmaterial 166. However, it should also be noted that the lamination head140 may be configured to temporarily slow or stop the dispensing oflayup material 166 if needed to allow the cutter assembly 340 such as toform complex cuts (not shown) in the layup material 166.

Referring to FIG. 26, shown is an example of a lamination head 140 inwhich the backing layer directional control device 224 is configured asa translating device 320 that is movable between the neutral position300, the first mode separation position 304, and the second modeseparation position 306. The translating device 320 may be configured totranslate along a linear path and/or along an arcuate path between theneutral position 300, the first mode separation position 304 and thesecond mode separation position 306. Movement of the translating device320 between the neutral position 300, the first mode separation position304, and the second mode separation position 306 may be facilitated by alinear motion mechanism (not shown) such as a screw drive that isrotatable via a servo motor controlled by the controller 130 in themanner described above with regard to the above-described pivotingdevice 310 illustrated in FIGS. 15-18.

In FIG. 26, the translating device 320 may be provided as a stub 322geometrically configured as a wedge, a cylinder, or a post. The stub 322may have a non-movable outer surface which may be a low-friction surfacesuch as a smooth or polished surface enabling the backing layer 168 toslide over the outer surface as the backing layer 168 is fed through thelamination head 140. In an alternative embodiment, the stub 322 may beconfigured as a roller configured to freely rotate about a roller axis(not shown) as the backing layer 168 moves around the roller. As may beappreciated, the translating device 320 may be provided in a widevariety of different sizes and shapes. Regardless of the configuration,the translating device 320 may have a relatively small radius that maybe sized based on the axial stiffness of the layup material 166 and/orbased on the level of adhesion between the layup material 166 and thebacking layer 168. In this regard, the translating device 320 may besized to cause the layup material leading edge 174 to peel away from thebacking layer 168 under the urging of the first or second separator edge254, 264 for respectively of the first backing layer separator 252 orsecond backing layer separator 272, as described above with regard tothe pivoting device 310 shown in FIGS. 15-18.

FIG. 27 shows an example of a lamination head 140 having a mountingframe 142 having a first side 144 and a second side 146 located oppositethe first side 144. The lamination head 140 includes a first laminationassembly 152 mounted on the first side 144 of the mounting frame 142 anda second lamination assembly 154 mounted on the second side 146 of themounting frame 142. The first lamination assembly 152 includes theabove-described head components for applying layup material 166 to asubstrate 118, including a material supply drum 160, a backing layercollection drum 180, and a backing layer separation assembly 220. Thefirst lamination assembly 152 may additionally include a cutter assembly340, redirect rollers 210, and other lamination head components. Thesecond lamination assembly 154 may have substantially the samearrangement of head components as the first lamination assembly 152, atleast including the material supply drum 160, the backing layercollection drum 180, and the backing layer separation assembly 220.

In FIG. 27, the mounting frame 142 may be pivotable about a verticalaxis 148 to allow the first lamination assembly 152 to be available forapplying layup material 166 to the substrate 118 while the secondlamination assembly 154 is available (e.g., physically accessible) forreplacing or changing out the material roll 162 of the second laminationassembly 154. For example, prior to moving the lamination head 140 ordispensing layup material 166 from the first lamination assembly 152,the material roll 162 of the second lamination assembly 154 may beavailable for manual or autonomous replacement, as described above.Alternatively, the mounting frame 142 may be pivoted about the verticalaxis 148 such that the second lamination assembly 154 is available todispense layup material 166 while the first lamination assembly 152 isavailable for manual or autonomous changeout or replacement of thematerial roll 162 of the first lamination assembly 152. The ability topivot the mounting frame 142 of a lamination head about a vertical axis148 for making the first or second lamination assembly 152, 154available for dispensing layup material 166 while the remaining first orsecond lamination assembly 152, 154 is available for replacement of thematerial roll 162 may avoid the cost and complexity associated with duallamination heads (not shown) in which one lamination head is availablefor dispensing layup material while the other lamination head isreloaded with a new or different material roll.

FIG. 28 is a flowchart of operations included in a method 400 ofthreading layup material 166 in a lamination head 140 configured tosupport a material supply drum 160. Step 402 of the method 400 includessupporting, on the material supply drum 160, a material roll 162 ofbacked material 164 as shown in FIG. 6. As described above, the backedmaterial 164 comprises layup material 166 backed by a backing layer 168.As also mentioned above, the outermost wraps of the material roll 162are typically comprised of backing layer 168 only (i.e., abacking-layer-only portion) without any layup material 166. Thebacking-layer-only portion may be self-threaded through the laminationhead as described below. However, a material roll 162 may be providedwithout a backing-layer-only portion, in which case the backed material164 (e.g., layup material 166 backed by a backing layer 168) may beself-threaded through the lamination head 140 in the same manner asdescribed below for a material roll 162 having a backing-layer-onlyportion.

Step 404 of the method 400 includes translating a backing layercollection drum 180 from a collection drum home position 182 to acollection drum engagement position 184 proximate the material supplydrum 160 as shown in FIG. 6-7. As described above, the backing layercollection drum 180 may be moved by a linear actuation mechanism (notshown) under command of a controller 130 of the lamination head 140.

Step 406 of the method 400 includes engaging the backing layercollection drum 180 with a backing layer leading edge 170 of the backinglayer 168 on the material roll 162. As described above, the outermostwraps on the material roll 162 may be comprised primarily of backinglayer 168 only (e.g., a backing-layer-only portion) without any layupmaterial 166 on the backing layer 168. Alternatively, as mentionedabove, the outermost wraps on a material roll 162 may be comprised ofbacked material 164 (e.g., layup material 166 backed by a backing layer168). Regardless of the configuration of the outermost wraps of thematerial roll 162, the step of engaging the backing layer collectiondrum 180 with the backing layer leading edge 170 may comprise engaging abacking layer pick element 190 of the backing layer collection drum 180to the backing layer leading edge 170 on the material roll 162 as shownin FIG. 7. The method may further include pulling, using the backinglayer collection drum 180, the backing layer leading edge 170 away fromthe material supply drum 160 when translating the backing layercollection drum 180 to the collection drum engagement position 184, asshown in FIG. 12.

Referring briefly to FIGS. 8-11, the process of engaging the backinglayer pick element 190 with the backing layer leading edge 170 may beperformed by any one a variety of different options. For example,engaging the backing layer pick element 190 with the backing layerleading edge 170 may be performed by magnetically coupling a magnet 192on the backing layer collection drum 180 to a magnetic element 194mounted on the backing layer leading edge 170 as shown in FIG. 8. Inanother example, the backing layer pick element 190 may be a vacuumnozzle 198 configured for vacuum attachment to an outer surface of thebacking layer leading edge 170 as shown in FIG. 10. In a still furtherexample, engagement of the backing layer pick element 190 with thebacking layer leading edge 170 may be performed by engaging a hookelement 202 on the backing layer collection drum 180 to a loop element204 mounted on the backing layer leading edge 170, for engaging a loopelement 204 on the backing layer collection drum 180 to a hook element202 mounted on the backing layer leading edge 170 as shown in FIG. 11.

Step 408 of the method 400 includes translating the backing layercollection drum 180 back to the collection drum home position 182 whiledispensing a threadable portion 172 of at least the backing layer 168between the material supply drum 160 and the backing layer collectiondrum 180 as shown in FIG. 12. During translation of the backing layercollection drum 180 to the collection drum home position 182, thecontroller 130 may control the rotation of the material supply drum 160and the backing layer collection drum 180 to maintain a predeterminedlevel of tension within the threadable portion 172 extending between thebacking layer collection drum 180 and the material supply drum 160.

Step 410 of the method 400 includes translating a backing layerseparation device 222 from a separation device home position 226 to aseparation device engagement position 228. For embodiments of thelamination head 140 having bi-directional layup capability as describedabove, the backing layer separation device 222 may be configured as abacking layer directional control device 224 (FIG. 7) which isconfigured to facilitate separation of the layup material 166 from thebacking layer 168 in both a first mode separation position 304 (FIG. 15)and in a second mode separation position 306 (FIG. 17) as describedabove.

Step 412 of the method 400 includes moving the threadable portion 172into proximity to a backing layer separation mechanism as shown in FIG.13. As described above, the lamination head 140 includes at least onebacking layer separation mechanism configured to separate the backinglayer 168 from the layup material 166 prior to application of the layupmaterial 166 onto a substrate 118. For example, the figures illustratethe lamination head 140 having a first backing layer separationmechanism 250 and a second backing layer separation mechanism 270 forembodiments of the lamination head 140 having bi-directional layupcapability. However, as indicated above, the lamination head 140 may beprovided in an embodiment having a single backing layer separationmechanism (e.g., a first backing layer separation mechanism 250).

The step 412 of moving the threadable portion 172 into proximity to atleast one backing layer separation mechanism (e.g., the first backinglayer separation mechanism 250 or the second backing layer separationmechanism 270) may include moving the threadable portion 172 intoalignment with a backing layer separator and a guide member of thebacking layer separation mechanism (e.g., FIG. 15). In addition, step412 may include separating the backing layer 168 from the layup material166 using a separator edge positioned in close proximity to the backedmaterial 164, and guiding the layup material 166 onto the substrate 118using a guide surface of a guide member, as shown in FIG. 16.

Referring to FIG. 12, as part of the threading process, the method 400may include translating a cutter platen 342 from a platen home position344 to a platen engagement position 346 before, during or aftertranslation of the backing layer separation device 222 from theseparation device home position 226 to the separation device engagementposition 228. As described above, the method may include moving, inresponse to translation of the cutter platen 342, the threadable portion172 into engagement with the cutter module 348 to allow for cutting ofthe layup material 166 during application onto the substrate 118. Asdescribed above, the cutter assembly 340 may cut the layup material 166while leaving the backing layer 168 intact as the backed material 164passes through the cutter assembly 340.

Referring briefly to FIGS. 22-25, the method 400 may include cutting thelayup material 166 as the backed material 164 moves through the cutterassembly 340 as a means to reduce lamination head downtime. For example,the method may include moving a cutter blade 350 across the layupmaterial 166 along a blade travel vector 354 having a longitudinalcomponent 356 that is proportional to the material feed rate 360 atwhich the backed material 164 passes through the cutter assembly 340. Toform an intended cut line 358 that is oriented perpendicular (FIG. 25)to the lengthwise direction of the backed material 164, the cutter blade350 may be moved at a blade travel vector 354 having a longitudinalcomponent 356 that is equivalent to the material feed rate 360. For anintended cut line 358 oriented non-perpendicular (not shown) to thelengthwise direction of the backed material 164, the cutter blade 350may be moved along a blade travel vector 354 having a longitudinalcomponent 356 that is either less than or greater than the material feedrate 360.

As mentioned above, the lamination head 140 has at least one backinglayer separation assembly 220 which includes a backing layer separator(e.g., a first backing layer separator 252 and/or a second backing layerseparator 272) and a guide member (e.g., a first guide member 256 and/ora second guide member 276). In some examples, the method 400 may includeadjusting the orientation of the first guide member 256 and/or a secondguide member 276 in a manner to respectively adjust a pitch angle 260,280 respectively of the guide surface 258, 278. As described above andshown in FIG. 16, the first and pitch angle 260, 280 may be measuredrelative to a portion of the layup material 166 immediately upstreamrespectively of the first and second guide member 256, 276. To allow thelayup material leading edge 174 to pass onto the first or second guidesurface 258, 278 respectively of the first or second guide member 256,276 without kinking or bending of the layup material 166, the first orsecond pitch angle 260, 280 may be adjusted based upon the axialstiffness of the layup material 166. For example, the first or secondguide member 256, 276 may be pivotably adjusted such that the respectivefirst or second guide surface 258, 278 is oriented respectively at afirst or second pitch angle 260, 280 that is larger for a layup material166 having a relatively high axial stiffness (e.g., unidirectionalprepreg tape) than the first or second pitch angle 260, 280 for a layupmaterial 166 having relatively low axial stiffness (e.g., woven clothprepreg tape). As shown in FIGS. 16 and 18, a lamination head 140 havingbi-directional layup capability includes a first backing layerseparation mechanism 250 having has a first backing layer separator 252and a first guide member 256, and the lamination head 140 also has asecond backing layer separation mechanism 270 having a second backinglayer separator 272 and a second guide member 276. The first guidemember 256 and/or the second guide member 276 may be pivotably adjustedsuch that the respective first guide surface 258 and second guidesurface 278 is complementary to the axial stiffness of the layupmaterial 166.

For a lamination head 140 having bi-directional layup capability, thebacking layer separation device 222 is configured as a backing layerdirectional control device 224 as mentioned above. In such example, themethod 400 may include moving the backing layer directional controldevice 224 between a first mode separation position 304 (FIGS. 15-16)and a second mode separation position 306 (FIG. 17-18. When the backinglayer directional control device 224 is in the first mode separationposition 304, the method includes separating the backing layer 168 fromthe layup material 166 while the layup material 166 is applied to thesubstrate 118 as the lamination head 140 moves along the first directionof travel 370 (FIG. 16). When the backing layer directional controldevice 224 is in the second mode separation position 306, the method 400includes separating the backing layer 168 from the layup material 166while the layup material 166 is applied to the substrate 118 as thelamination head 140 moves along the second direction of travel 372opposite the first direction of travel 370 (FIG. 18).

In some examples, the method 400 may include moving the backing layerdirectional control device 224 between a neutral position 300 (FIG. 13),the first mode separation position 304 (FIG. 15) and the second modeseparation position 306 (FIG. 17). As shown in FIG. 13, the neutralposition 300 may be located between the first mode separation position304 and the second mode separation position 306. As mentioned above, thefirst backing layer separation mechanism 250 and the second backinglayer separation mechanism 270 may each be incapable of separating thelayup material 166 from the backing layer 168 when the backing layerdirectional control device 224 is in the neutral position 300.Advantageously, the neutral position 300 may provide clearance andaccess to the first backing layer separation mechanism 250 and thesecond backing layer separation mechanism 270 such as for maintenance.

Referring briefly to FIGS. 19-21, when the material roll 162 on thematerial supply drum 160 is depleted of layup material 166, the method400 may include translating the backing layer separation device 222(e.g., the backing layer directional control device 224) from theseparation device engagement position 228 back to the separation devicehome position 226 as shown in FIG. 19. In addition, the method mayinclude translating the cutter platen 342 from the platen engagementposition 346 to the platen home position 344 as is also shown in FIG.19. The controller 130 may be operated to rotate the material supplydrum 160 and the backing layer collection drum 180 in a manner tomaintain a predetermined level of tension within a lengthwise portion ofat least the backing layer 168 extending between the backing layercollection drum 180 and the material supply drum 160 as shown in FIG.19.

The method 400 may include translating the backing layer collection drum180 from the collection drum home position 182 (FIG. 19) to thecollection drum engagement position 184 proximate the material supplydrum 160 as shown in FIG. 20, in response to the material supply drum160 being depleted of backed material 164. The method may additionallyinclude winding the backing layer 168 onto the material supply drum 160during synchronized rotation of the material supply drum 160 and backinglayer collection drum 180 as shown in FIG. 21. After the backing layer168 is wound onto the material supply drum 160, the method 400 mayinclude translating the backing layer collection drum 180 back to thecollection drum home position 182 as shown in FIG. 21, after which themethod may include removing the material roll 162 (containing backinglayer 168 only) from the material supply drum 160 for possiblereplacement with a new or different material roll 162.

Referring briefly to FIG. 27, the lamination head 140 may optionallyinclude a mounting frame 142 having a first lamination assembly 152mounted to a first side 144 of the mounting frame 142 and a secondlamination assembly 154 mounted to a second side 146 of the mountingframe 142 opposite the first side 144. As mentioned above, the firstlamination assembly 152 and the second lamination assembly 154 may eachinclude at least a material supply drum 160, a backing layer collectiondrum 180, and a backing layer separation assembly 220. In such example,the method 400 may include applying layup material 166 to the substrate118 using the first lamination assembly 152, pivoting the mounting frame142 about a vertical axis 148, and applying layup material 166 to thesubstrate 118 using the second lamination assembly 154. When the firstlamination assembly 152 is available for applying or dispensing layupmaterial 166, the second lamination assembly 154 is available forreplacing the material roll 162 on the second lamination assembly 154.Conversely, when the second lamination assembly 154 is available forapplying or dispensing layup material 166, the first lamination assembly152 is available for replacing the material roll 162 on the firstlamination assembly 152. As mentioned above, the ability to pivot thelamination head 140 about a vertical axis 148 for making the firstlamination assembly 152 available for dispensing layup material 166while the remaining second lamination assembly 154 is available forreplacement of the material roll 162 may avoid the need for two separatelamination heads (not shown), one of which is positioned for dispensinglayup material while the other lamination head is positioned forreloading with a new or different material roll.

Referring to FIG. 29, shown is a flowchart of operations included in amethod 500 of bi-directionally applying layup material 166 onto asubstrate 118. Step 502 of the method 500 includes feeding backedmaterial 164 from a material roll 162 to a backing layer separationassembly 220 of a lamination head 140. As described above and shown inthe figures, the material roll 162 is mounted on the material supplydrum 160. The backed material 164 comprises layup material 166 backed bya backing layer 168. The backing layer separation assembly 220 has abacking layer directional control device 224 that is movable between afirst mode separation position 304 and a second mode separation position306 as shown in FIG. 6.

When the backing layer directional control device 224 is in the firstmode separation position 304 as shown in FIG. 16, step 504 of the method500 includes separating the layup material 166 from the backing layer168 using the first backing layer separation mechanism 250 whileapplying layup material 166 to the substrate 118 when moving thelamination head 140 along the first direction of travel 370. Step 506 ofthe method 500 includes moving the backing layer directional controldevice 224 from the first mode separation position 304 to the secondmode separation position 306 as shown in FIG. 17. The step 506 of movingthe backing layer directional control device 224 from the first modeseparation position 304 (FIG. 16) to the second mode separation position306 (FIG. 18) may be performed by pivoting a pivoting device 310 about aproximal end 312 of the pivoting device 310. As a result of pivoting thepivoting device 310 about the proximal end 312, the distal end 314 ofthe pivoting device 310 moves between the first mode separation position304 and the second mode separation position 306. As described above, thedistal end 314 of the pivoting device 310 positions the backed material164 into close proximity to the first backing layer separation mechanism250 or the second backing layer separation mechanism 270 to allowrespectively allow the first separator edge 254 or the second separatoredge 274 to engage the layup material leading edge 174.

Referring briefly FIG. 26, in an alternative embodiment, the step 506 ofmoving the backing layer directional control device 224 from the firstmode separation position 304 to the second mode separation position 306may be performed by translating a translating device 320 between thefirst mode separation position 304 and the second mode separationposition 306. For example, the transiting device may be translated via alinear motion mechanism (not shown) controlled by the controller 130. Asdescribed above, the translating device 320 may be provided as a stub322, a roller 324, or any one a variety of other devices configured totranslate between the first mode separation position 304 and the secondmode separation position 306.

In still further examples, the method 500 may include moving the backinglayer directional control device 224 between the neutral position 300,the first mode separation position 304, and the second mode separationposition 306. As described above and shown in FIG. 13, the neutralposition 300 may be located between the first mode separation position304 and the second mode separation position 306. Positioning the backinglayer directional control device 224 in the neutral position 300 mayprovide clearance and access for servicing the first backing layerseparation mechanism 250 and the second backing layer separationmechanism 270. When the backing layer directional control device 224 isin the neutral position 300, clearance in access may also be provided tothe first backing layer separation mechanism 250 and the second backinglayer separation mechanism 270 by at least partially retracting thebacking layer directional control device 224 into a retracted position302 within the lamination head 140 as shown in FIG. 14.

When the backing layer directional control device 224 is in the secondmode separation position 306 as shown in FIG. 18, the method 500includes step 508 of separating the layup material 166 from the backinglayer 168 using the second backing layer separation mechanism 270 whileapplying layup material 166 to the substrate 118 when moving thelamination head 140 along the second direction of travel 372 oppositethe first direction of travel 370. As described above, during theapplication of layup material 166 along the first direction of travel370 and/or along the second direction of travel 372, the method 500 mayinclude cutting the layup material 166 by moving a cutter blade 350across the layup material 166 as shown in FIGS. 22-25. Cutting the layupmaterial 166 while leaving the backing layer 168 intact results in thecreation of a layup material leading edge 174 and a layup materialtrailing edge 176. As described above, the first separator edge 254 ofthe first backing layer separator 252 and the second separator edge 274of the second backing layer separator 272 are each configured to engagethe layup material leading edge 174 and guide the layup material 166respectively onto the first guide member 256 and second guide member 276when the backing layer directional control device 224 is respectively inthe first mode separation position 304 (FIG. 16) and the second modeseparation position 306 (FIG. 18).

The method 500 may include cutting the layup material 166 as the backedmaterial 164 moves through the cutter assembly 340. For example, asshown in FIGS. 22-25 and described above, the method may include movingthe cutter blade 350 across the layup material 166 along a blade travelvector 354 that is proportional to a material feed rate 360 of thebacked material 164. For forming an intended cut line 358 orientedperpendicular to the lengthwise direction of the backed material 164,the method 500 includes moving the cutter blade 350 across the materialwidth of the layup material 166 at a blade travel vector 354 having alongitudinal component 356 that is equivalent to the material feed rate360.

In some examples, step 504 of separating the layup material 166 from thebacking layer 168 using the first backing layer separation mechanism250, and step 508 of separating the layup material 166 from the backinglayer 168 using the second backing layer separation mechanism 270respectively comprise using a first or second separator edge 254, 274respectively of a first or second backing layer separator 252, 272 toseparate the backing layer 168 from the layup material 166, andrespectively using a first or second guide surface 258, 278 respectivelyof a first or second guide member 256, 276 to support the layup material166 after separation from the backing layer 168 and to guide the layupmaterial 166 onto the substrate 118. For example, step 504 includesusing a first backing layer separator 252 to separate the layup materialleading edge 174 from the backing layer 168 and using the first guidemember 256 to guide the layup surface 116 onto the substrate 118. Step508 includes using the second backing layer separator 272 to separatethe layup material leading edge 174 from the backing layer 168 and usingthe second guide member 276 to guide the layup surface 116 onto thesubstrate 118. The method 500 may include winding the backing layer 168onto the backing layer collection drum 180 during the separation of thebacking layer 168 from the layup material 166.

As described above with regard to FIGS. 16 and 18, the first guidemember 256 and the second guide member 276 each have a guide surface258, 278 over which the layup material 166 slides prior to applicationof the layup material 166 onto the substrate 118. The method 500 mayadditionally include adjusting the first or second pitch angle 260, 280(FIGS. 16 and 18) respectfully of the first for second guide surface258, 278 respectively of the first or second guide member 256, 278 basedupon the axial stiffness of the layup material 166. As mentioned above,a first or second pitch angle 260, 280 respectively of a first or secondguide surface 258, 278 is measured relative to the portion of the layupmaterial 166 located immediately upstream respectively of the first orsecond guide member 256, 276. The first or second pitch angle 260, 280may be adjusted to be larger for a layup material 166 having arelatively high axial stiffness than the pitch angle 260, 280 for alayup material 166 having a relatively low axial stiffness. As shown inFIGS. 16 and 18, the method 500 may further include using a firstcompaction device 262 or a second compaction device 282 to applycompaction pressure onto the layup material 166 against the substrate118 as the lamination head 140 moves respectively along the firstdirection of travel 370 and the second direction of travel 372.

In the above-described examples of the lamination head 140 havingself-threading capability, the method 500 may include translating thebacking layer collection drum 180 from a collection drum home position182 (FIG. 6) to a collection drum engagement position 184 (FIG. 7)proximate the material supply drum 160 prior to feeding layup material166 from the material supply drum 160 to the backing layer separationassembly 220. The method may additionally include engaging the backinglayer collection drum 180 with the backing layer leading edge 170 of thebacking layer 168 as shown in FIG. 7. Upon engaging the backing layerleading edge 170, the method may include translating the backing layercollection drum 180 back to the collection drum home position 182 whiledispensing a threadable portion 172 of at least the backing layer 168between the material supply drum 160 and the backing layer collectiondrum 180 as shown in FIG. 12. The method may then include translatingthe backing layer directional control device 224 from the separationdevice home position 226 (FIG. 12) to the separation device engagementposition 228 as shown in FIG. 13. In addition, the method may includemoving the threadable portion 172 into proximity to the first backinglayer separation mechanism 250 and/or the second backing layerseparation mechanism 270. When the material roll 162 on the materialsupply drum 160 is depleted of layup material 166, the method 500 mayincluding rewinding the backing layer 168 on the backing layercollection drum 180 back onto the material supply drum 160 as describedabove for method 400 and as illustrated in FIGS. 19-21.

Additional modifications and improvements of the present disclosure maybe apparent to those of ordinary skill in the art. Thus, the particularcombination of parts described and illustrated herein is intended torepresent only certain embodiments of the present disclosure and is notintended to serve as limitations of alternative embodiments or deviceswithin the spirit and scope of the disclosure.

What is claimed is:
 1. A lamination head having bi-directional layupcapability, comprising: a material supply drum configured to support amaterial roll of backed material, the backed material comprising layupmaterial backed by a backing layer; a backing layer separation assemblyconfigured to receive the backed material from the material supply drumand having a backing layer directional control device, a first backinglayer separation mechanism, and a second backing layer separationmechanism; the backing layer directional control device being movable atleast between a first mode separation position and a second modeseparation position; the backing layer directional control device in thefirst mode separation position being aligned with the first backinglayer separation mechanism for separating the backing layer from thelayup material while the layup material is applied to a substrate as thelamination head moves along a first direction of travel; and the backinglayer directional control device in the second mode separation positionbeing aligned with the second backing layer separation mechanism forseparating the backing layer from the layup material while the layupmaterial is applied to the substrate as the lamination head moves alonga second direction of travel opposite the first direction of travel. 2.The lamination head of claim 1, wherein the backing layer directionalcontrol device comprises: a pivoting device having a proximal end and adistal end; and the pivoting device being pivotable about the proximalend to move the distal end between the first mode separation positionand the second mode separation position.
 3. The lamination head of claim2, wherein the pivoting device comprises: a proximal belt roller and adistal belt roller spaced apart from each other and surrounded by aroller belt; and the roller belt moving around the proximal belt rollerand the distal belt roller as the backing layer moves with the rollerbelt.
 4. The lamination head of claim 1, wherein the backing layerdirectional control device comprises: a translating device configured totranslate between the first mode separation position and the second modeseparation position.
 5. The lamination head of claim 4, wherein thetranslating device comprises: a stub having an outer surface configuredto have the backing layer slidably bear against the outer surface; or aroller configured to freely rotate about a roller axis as the backinglayer moves over the roller.
 6. The lamination head of claim 1, wherein:the first backing layer separation mechanism and the second backinglayer separation mechanism each have a backing layer separator and aguide member; the backing layer separator having a separator edgeconfigured to separate the backing layer from the layup material; andthe guide member having a guide surface configured to support the layupmaterial after separation from the backing layer and guide the layupmaterial onto the substrate.
 7. The lamination head of claim 6, wherein:the guide member of the first backing layer separation mechanism and/orthe second backing layer separation mechanism being pivotably adjustablefor adjusting a pitch angle of the guide surface relative to alengthwise portion of the layup material located immediately upstream ofthe guide member.
 8. The lamination head of claim 1, wherein: thebacking layer directional control device is movable from a neutralposition to the first mode separation position and movable from theneutral position to the second mode separation position.
 9. Thelamination head of claim 1, further comprising: a mounting frame havinga first side and a second side opposite the first side; a firstlamination assembly mounted to the first side and having the materialsupply drum and the backing layer separation assembly; a secondlamination assembly mounted to the second side and having a samearrangement of the material supply drum and the backing layer separationassembly as in the first lamination assembly; and the mounting framebeing pivotable about a vertical axis to make the first laminationassembly available to apply layup material to the substrate while makingthe second lamination assembly available for replacement of the materialroll.
 10. The lamination head of claim 1, further comprising: a backinglayer collection drum configured to translate from a collection drumhome position to a collection drum engagement position proximate thematerial supply drum, engage a leading edge of the backing layer on thematerial roll, and translate back to the collection drum home positionwhile dispensing a threadable portion of at least the backing layerbetween the material supply drum and the backing layer collection drum;and the backing layer directional control device configured to translatefrom a separation device home position to a separation device engagementposition and engage the threadable portion for moving the threadableportion into alignment with the first backing layer separation mechanismor the second backing layer separation mechanism; and the backing layercollection drum configured to take up the backing layer duringseparation of the backing layer from the layup material.
 11. Alamination head having bi-directional layup capability, comprising: amaterial supply drum configured to support a material roll of backedmaterial, the backed material comprising layup material backed by abacking layer; a backing layer separation assembly configured to receivethe backed material from the material supply drum and having a backinglayer directional control device, a first backing layer separationmechanism, and a second backing layer separation mechanism; the backinglayer directional control device being movable at least between a firstmode separation position and a second mode separation position; thebacking layer directional control device in the first mode separationposition being aligned with the first backing layer separationmechanism, the first backing layer separation mechanism having a firstbacking layer separator configured to separate the backing layer fromthe layup material and direct the layup material toward a substrate asthe lamination head moves along a first direction of travel; and thebacking layer directional control device in the second mode separationposition being aligned with the second backing layer separationmechanism, the first backing layer separation mechanism having a secondbacking layer separator configured to separate the backing layer fromthe layup material and direct the layup material toward the substrate asthe lamination head moves along a second direction of travel.
 12. Amethod of bi-directionally applying layup material onto a substrate,comprising: feeding a backed material from a material roll to a backinglayer separation assembly of a lamination head, the material rollmounted on a material supply drum, the backed material comprising layupmaterial backed by a backing layer, the backing layer separationassembly having a backing layer directional control device movablebetween a first mode separation position and a second mode separationposition; separating, with the backing layer directional control devicein the first mode separation position, the layup material from thebacking layer using a first backing layer separation mechanism whileapplying layup material to the substrate when moving the lamination headalong a first direction of travel; moving the backing layer directionalcontrol device from the first mode separation position to the secondmode separation position; and separating, with the backing layerdirectional control device in the second mode separation position, thelayup material from the backing layer using a second backing layerseparation mechanism while applying layup material to the substrate whenmoving the lamination head along a second direction of travel oppositethe first direction of travel.
 13. The method of claim 12, wherein thestep of moving the backing layer directional control device from thefirst mode separation position to the second mode separation positioncomprises: pivoting a pivoting device about a proximal end of thepivoting device; and moving a distal end of the pivoting device betweenthe first mode separation position and the second mode separationposition as a result of pivoting the pivoting device about the proximalend.
 14. The method of claim 13, wherein the pivoting device comprises:a proximal belt roller and a distal belt roller spaced apart from eachother and surrounded by a roller belt; and the roller belt moving aroundthe proximal belt roller and a distal belt roller as the backing layermoves with the roller belt.
 15. The method of claim 12, wherein the stepof moving the backing layer directional control device from the firstmode separation position to the second mode separation positioncomprises: translating a translating device between the first modeseparation position and the second mode separation position.
 16. Themethod of claim 12, wherein the steps of separating the layup materialfrom the backing layer using the first backing layer separationmechanism and separating the layup material from the backing layer usingthe second backing layer separation mechanism each comprise: separating,using a separator edge of a backing layer separator, the backing layerfrom the layup material; and supporting, using a guide surface of aguide member, the layup material after separation from the backing layerand guiding the layup material onto the substrate.
 17. The method ofclaim 16, further comprising: adjusting a pitch angle of the guidesurface of the guide member of the first backing layer separationmechanism and/or the second backing layer separation mechanism; and thepitch angle of the guide surface being relative to a portion of thelayup material immediately upstream of the guide member.
 18. The methodof claim 12, further comprising: moving the backing layer directionalcontrol device between a neutral position, the first mode separationposition and the second mode separation position; and the neutralposition being located between the first mode separation position andthe second mode separation position.
 19. The method of claim 12, whereinthe lamination head includes a mounting frame having a first laminationassembly mounted to a first side of the mounting frame supporting thematerial supply drum and the backing layer separation assembly, andhaving a second lamination assembly mounted to a second side of themounting frame opposite the first side, the second lamination assemblyhaving a substantially similar arrangement of a material supply drum anda backing layer separation assembly as in the first lamination assembly,the method further comprising: applying layup material to the substrateusing the first lamination assembly; and pivoting the mounting frameabout a vertical axis to make the second lamination assembly availablefor applying layup material to the substrate while making the firstlamination assembly available for replacing the material roll.
 20. Themethod of claim 12, wherein prior to feeding layup material from thematerial supply drum to the backing layer directional control device,the method comprises: translating a backing layer collection drum from acollection drum home position to a collection drum engagement positionproximate the material supply drum; engaging the backing layercollection drum with a backing layer leading edge of the backing layer;translating the backing layer collection drum back to the collectiondrum home position while dispensing a threadable portion of at least thebacking layer between the material supply drum and the backing layercollection drum; translating the backing layer directional controldevice from a separation device home position to a separation deviceengagement position; and moving, in response to translation of thebacking layer directional control device, the threadable portion intoproximity to the first backing layer separation mechanism or the secondbacking layer separation mechanism.